Buried Contact Group
- High Energy Efficiency Group
- Thin Film Group
- 3rd Generation Photovoltaics
- Silicon Photonics
- Collaborative Research
- Facilities & Infrastructure
University Staff:
Dr. Jeffrey Cotter (Group Leader)
Prof. Martin Green
A/Prof. Christiana Honsberg
Prof. Stuart Wenham
Project Scientists and Technicians:
Dr. Ximing Dai
Jamie Green
Kate Fisher
Research Associates:
Dr. Wolfgang Honsberg
Dr. Keith McIntosh
Dr. Tom Puzzer
Dr. Alistair Sproul
Ted Szpitalak
Dr. Otwin Breitenstein
The Buried-Contact Solar Cell Group aims to develop new solar cell structures and novel process technologies specifically for commercially relevant silicon wafers. The group has a broad spectrum of research and development activities that address the evolving nature of commercial silicon solar cells. The Group’s main activities are focused on developing high-efficiency, thin-wafer Buried-Contact solar cells, developing low-cost processing technologies and related device designs, and transferring BC technology to industrial and technical collaborators. Some of the group's work is highlighted here.
Double-sided Buried Contact (DSBC)solar cell
The Double-sided Buried Contact (DSBC) solar cell incorporates a high-efficiency rear surface design in the commercially successful Laser-groove or Buried-contact cell design.If successful, this structure will allow increased open-circuit voltage in thin-wafer solar cells.
Interdigitated Back Buried Contact (IBBC) solar cell
The Interdigitated Back Buried Contact (IBBC) design locates all metal electrodes on the rear surface of the wafer and enjoys reduced optical shading losses.
Laser Texturing for Multicrystalline Silicon
A method of laser texturing has been developed as a possible solution to the problem of texturing multicrystalline silicon. The texture was created by scanning a pulsed laser beam across the silicon surface.
Commercial Stencil Printed Silicon Solar Cells
Screen- and stencil-print capabilities are being set-up at UNSW. To achieve the fine, but thick lines needed to print contact pastes into a shallow groove, we are developing stencil making capabilities based on laser lithography.